| Weight | 0.001 KG / psc. |
| Commodity number | 85366990 |
| Country of origin | China |
| Dimensions (WxHxD) | |
| EAN code | 5713140205406 |
| Product group | |
| Category | Connectors |
| Series | har-flex® |
| Identification | HD-Card Edge |
| Element | Connector |
| Features | The sample packaging is not suitable for automated assembly. |
| Termination method | Reflow soldering termination (SMT) |
| Connection type | Motherboard to daughtercard |
| Number of contacts | 20 |
| Pack contents | Sample |
| Contact rows | 2 |
| Contact spacing (termination side) | 0.8 mm |
| Contact spacing (mating side) | 0.8 mm |
| Data rate | 25 Gbit/s |
| Clearance distance | ≥0.2 mm Backplane |
| Creepage distance | ≥0.2 mm Backplane |
| Limiting temperature | -55 ... +125 °C |
| Insertion force | ≤ 15 N |
| Withdrawal force | ≥ 4 N |
| Performance level | 1 |
| Mating cycles | ≥ 200 |
| Isolation group | IIIa (175 ≤ CTI < 400) |
| Moisture Sensitivity Level (MSL) | 1 acc. to ECA/IPC/JEDEC J-STD-020D |
| Process Sensitivity Level (PSL) | R0 acc. to ECA/IPC/JEDEC J-STD-020D |
| Coplanarity of contacts | ≤ 0.1 mm |
| Material (insert) | Liquid crystal polymer (LCP) |
| Colour (insert) | Black |
| Material (contacts) | Copper alloy |
| Surface (contacts) | Noble metal over Ni Mating side |
| Material flammability class acc to UL 94 | V-0 |
| ELV status | compliant |
| China RoHS | e |
| REACH Annex XVII substances | Not contained |
| REACH ANNEX XIV substances | Not contained |
| REACH SVHC substances | Not contained |
| California Proposition 65 substances | Not contained |
| eCl@ss | 27460201 PCB connector (board connector) |
| ETIM | EC002637 |
| UNSPSC 240 | 39121415 |
